Our thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink.
A high quality metallic solution that helps to ensure maximum dissipation of heat generated by the CPU for optimized performance and greater system stability; and is more effective than standard silicon-based heat grease/CPU paste, providing optimum protection against CPU heat damage.
Please see our support section for the Material Safety Data Sheet for SILVGREASE1.
Minimum Operating Temperature
Maximum Operating Temperature
Metal Oxide Compound
0.79" (20 mm)
2.64" (67 mm)
Better thermal conductivity over standard silicon-based compounds and negligible electrical conductivity for effective and safe use in high performance applications.